HID Global Partners with NXP to Enhance Card Flexibility And Security for e-ID/Smart Card Manufacturers

HID Global, has announced an ultra-thin Polycarbonate (PC) e-Pre-laminate inlay for electronic ID (e-ID) cards that is more than 30 percent thinner than alternatives.  The new offering is the first HID Global inlay to use its patented HID direct bonding platform technology, which is available for high frequency (HF) systems. NXP Semiconductors is HID Global’s first qualified partner supplying IC chips for this product.

HID Global’s new inlay takes advantage of its proven process of directly bonding chips to wire-embedded air-coil antennae for low-frequency animal ID and automotive applications, without the bulk of added modules. The company has successfully leveraged its direct bonding technology for HF applications, enabling manufacturers to develop the smallest HF formats available in the market while delivering uncompromised performance. By using this method in its new ultra-thin inlays, HID Global is providing smart cards with a durable and reliable connection between the card’s intelligence – the IC chip – and its antennae. In addition, the thinner inlay offers e-ID and smart card manufacturers more flexibility in card construction. The narrow dimensions of HID Global’s ultra-thin inlays – 200 microns instead of the typical 350 microns – provide manufacturers with room to add more security features on both sides of an e-ID card during construction, while still complying with international ISO thickness standards.